JPH0565569B2 - - Google Patents

Info

Publication number
JPH0565569B2
JPH0565569B2 JP62129288A JP12928887A JPH0565569B2 JP H0565569 B2 JPH0565569 B2 JP H0565569B2 JP 62129288 A JP62129288 A JP 62129288A JP 12928887 A JP12928887 A JP 12928887A JP H0565569 B2 JPH0565569 B2 JP H0565569B2
Authority
JP
Japan
Prior art keywords
solder
alloy
materials
lead frame
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62129288A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63293130A (ja
Inventor
Rensei Futatsuka
Shunichi Chiba
Tadao Sakakibara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Original Assignee
Mitsubishi Shindoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindoh Co Ltd filed Critical Mitsubishi Shindoh Co Ltd
Priority to JP12928887A priority Critical patent/JPS63293130A/ja
Publication of JPS63293130A publication Critical patent/JPS63293130A/ja
Publication of JPH0565569B2 publication Critical patent/JPH0565569B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Conductive Materials (AREA)
JP12928887A 1987-05-26 1987-05-26 半導体装置用Ｃｕ合金製リ−ドフレ−ム材 Granted JPS63293130A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12928887A JPS63293130A (ja) 1987-05-26 1987-05-26 半導体装置用Ｃｕ合金製リ−ドフレ−ム材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12928887A JPS63293130A (ja) 1987-05-26 1987-05-26 半導体装置用Ｃｕ合金製リ−ドフレ−ム材

Publications (2)

Publication Number Publication Date
JPS63293130A JPS63293130A (ja) 1988-11-30
JPH0565569B2 true JPH0565569B2 (en]) 1993-09-20

Family

ID=15005869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12928887A Granted JPS63293130A (ja) 1987-05-26 1987-05-26 半導体装置用Ｃｕ合金製リ−ドフレ−ム材

Country Status (1)

Country Link
JP (1) JPS63293130A (en])

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2870780B2 (ja) * 1989-02-01 1999-03-17 日立電線株式会社 リードフレーム用高強度銅合金
JP2870779B2 (ja) * 1989-02-01 1999-03-17 日立電線株式会社 リードフレーム用高強度銅合金
JPH02205644A (ja) * 1989-02-01 1990-08-15 Hitachi Cable Ltd リードフレーム用高強度銅合金
JPH02205643A (ja) * 1989-02-01 1990-08-15 Hitachi Cable Ltd リードフレーム用高強度銅合金
JP2673973B2 (ja) * 1991-03-07 1997-11-05 三菱伸銅 株式会社 耐熱間圧延割れ性のすぐれた高強度Ｃｕ合金

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61174345A (ja) * 1985-01-30 1986-08-06 Hitachi Metals Ltd リ−ドフレ−ム用銅合金
JPS61264144A (ja) * 1985-05-20 1986-11-22 Nippon Mining Co Ltd 半田耐熱剥離性に優れた高力高導電銅合金
JPS63192835A (ja) * 1987-02-05 1988-08-10 Furukawa Electric Co Ltd:The セラミツクパツケ−ジ用リ−ド材
JP2555067B2 (ja) * 1987-04-24 1996-11-20 古河電気工業株式会社 高力銅基合金の製造法

Also Published As

Publication number Publication date
JPS63293130A (ja) 1988-11-30

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